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HLMP-FW00
5mm Flat Top InGaN White LED Lamp
Data Sheet
Description
This wide viewing angle white LED lamp is based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram.
Features
Wide viewing angle: 90 * Flat top * High intensity InGaN technology
Applications
* Electronic Signs and Signals * Small Area Illumination * Legend Backlighting * General Purpose Indicators
Benefit
* Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light Sources
Package Dimensions
Notes : 1. All dimensions are in milimetres /inches. 2. Epoxy meniscus may extend about 1mm (0.040") down the leads.
CAUTION : These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Min Luminous Intensity Iv (mcd) @ 20mA 40 Max Luminous Intensity Iv (mcd) @ 20mA 680
Part Number HLMP-FW00-JM0XX
Tolerance for intensity bin limit is +/-15%
Absolute Maximum Ratings (TA = 25C)
Parameter DC Forward Current [1] Peak Forward Current [] Power Dissipation Reverse Voltage (IR = 10mA) LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10%, 1 KHz.
Value 30 100 111 5 110 -40 to +85 -40 to +100
Units mA mA mW V C C C
Electrical Characteristics (TA = 25C)
Forward Voltage VF (V) @ IF = 20 mA Typ. 3. Reverse Breakdown VR (V) @ IR = 10mA Max. 3.7 Capacitance C (pF), VF = 0,f = 1 MHz Min. 5 Thermal Resistance RqJ-PIN (C/W) Typ. 70 Typ. 40
Optical Characteristics (TA = 25C)
Typical Chromaticity Coordinates [1] x 0.3 y 0.3 90 Viewing Angle 2q1/2 Degrees [2] Typ.
Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1.0
35 30
RELATIVE LUMINOUS INTENSITY
0.8 0.6 0.4 0.2 0 380
FORWARD CURRENT - mA
480 580 WAVELENGTH - nm 680 780
25 20 15 10 5 0
0 1 2 3 4
FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
1.5
0.025 0.020 0.015
1 mA 5 mA 10 mA 15 mA 20 mA 25 mA 30 mA
RELATIVE LUMINOUS INTENSITY
1.2 0.9 0.6 0.3 0
Y-COORDINATES
0.010 0.005 0 -0.005
0
10
20
30
-0.010 -0.004
-0.002
0 X-COORDINATES
0.002
0.004
FORWARD CURRENT - mA
(X,Y) VALUES @ 20 mA REFERENCE TO (0,0)
Figure 3. Relative Iv vs. Forward Current
Figure 4. Chromaticity shift vs. current
I F MAX. - MAXIMUM FORWARD CURRENT - mA
35
1.0 RELATIVE LUMINOUS INTENSITY
0 20 40 60 80 100
30 25 20 15 10 5 0
0.5
0.0
-90
-60
-30
0
30
60
90
T A - AMBIENT TEMPERATURE - C
ANGULAR DISPLACEMENT - Degree
Figure 5. Maximum Fwd. Current vs Temperature
Figure 6. Spatial Radiation Pattern
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Intensity Bin Limits (mcd at 20 mA)
Bin J K L M Min. 40 310 400 50 Max. 310 400 50 680
Color Bin Limit Tables
Rank 1 3 4 x y x y x y x y Limits (Chromaticity Coordinates) 0.330 0.360 0.87 0. 95 0.64 0.67 0.83 0.305 0.330 0.318 0.96 0.76 0.80 0.48 0.87 0.95 0.356 0.351 0.330 0.318 0.96 0.76 0.330 0.339 0.361 0.385 0.330 0.339 0.83 0.305 0.330 0.360
Tolerance for each bin limit is 15%
Tolerance for each bin limit is 0.01
Relative Light Output vs. Junction Temperature
1.4 RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25 C) 1.2 1.0 0.8
Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram
0.40
0.35
4 2
1
Y-coordinate
0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 100 120
0.30 3 0.25
Black Body Curve
TJ - JUNCTION TEMPERATURE - C 0.20 0.26
0.3 X-coordinate
0.34
0.38
Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for information on currently available
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Precautions:
Lead Forming:
* The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. * Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25uC before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through holes LED component ead size 0.457 x 0.457mm (0.018 x 0.018inch) 0.508 x 0.508mm (0.00 x 0.00inch) Diagonal 0.646 mm (0.05 inch) 0.718 mm (0.08 inch) Plated through hole diameter 0.976 to 1.078 mm (0.038 to 0.04 inch) 1.049 to 1.150mm (0.041 to 0.045 inch)
Soldering Condition:
* Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering condition: Wave Soldering Pre-heat temperature Preheat time Peak temperature Dwell time 105 C Max. 30 sec Max 50 C Max. 3 sec Max. Manual Solder Dipping 60 C Max. 5 sec Max
Note: Refer to application note AN1027 for more information on soldering LED components.
Recommended Wave Soldering Profile
TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE
200 BOTTOM SIDE OF PC BOARD
TEMPERATURE - C
150 FLUXING 100
TOP SIDE OF PC BOARD
50 30 PREHEAT 10 20 30 40 50 TIME - SECONDS 60 70 80 90 100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
0
5
DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4143EN AV0-045EN - May 15, 007

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